Invitation to BOND SHENZHEN 2026<

Dear Partners,

Methyl Group is pleased to announce our participation in the 7th Shenzhen International Adhesives, Sealants, and Dispensing Equipment Exhibition (BOND SHENZHEN 2026) from June 10–12, 2026.

We invite you to visit us and discover how our advanced material solutions can enhance your product reliability and performance.

 

📍 Exhibition Info:

• Venue: Shenzhen World Exhibition & Convention Center (Bao'an New Venue)

• Booth: 14G01

🌟 Key Highlights:

• Ultra-Thin Waterproof & Insulation Coating:

  • Rating: IPX8 high standard of waterproof level

  • Precision: 60μm average thickness—offering robust protection with a minimal footprint for sleek device designs.

• Liquid Shielding Solution (LSS):

  • Innovation: A high-efficiency alternative to traditional metal shields.

  • Benefit: Significant weight reduction and streamlined assembly.

  • Performance: 35-40dB EMI shielding effectiveness (@750MHz-7.6GHz).

💡 Why Visit Us?

• 1-on-1 Consultation: Discuss your application challenges with our technical experts.

• Tailored Solutions: Request customized test reports and specialized material recommendations.

We look forward to meeting you at Booth 14G01!